Hello to all the friends of the forum. As a headline I have problems with this macbook and the bga ati. Basically I soldered a new bga with datacode 2017
The bga in question is 216-0810005
I soldered it and the macbook started perfectly showing the image correctly. The defect arises when I start the stress tests as "unigine heaven". The temperature rises to 80 ° c and begins to show lines. I was thinking of a bga welding defect, so I put the motherboard back into the rework machine and let it do another cycle and add a lot of flux. The bga solder better on the left side and starts re-testing with a unigine heaven. Perfect, no defect and I keep it for several hours. After a day, I repeat the stress test procedure, but after twenty minutes he starts showing flaws with lines again. I think the bga arrived at this point is bad. See-ic and golden chipset do not have this replacement. I believe it is a defect of the bga itself and not of welding.
Thank you
The bga in question is 216-0810005
I soldered it and the macbook started perfectly showing the image correctly. The defect arises when I start the stress tests as "unigine heaven". The temperature rises to 80 ° c and begins to show lines. I was thinking of a bga welding defect, so I put the motherboard back into the rework machine and let it do another cycle and add a lot of flux. The bga solder better on the left side and starts re-testing with a unigine heaven. Perfect, no defect and I keep it for several hours. After a day, I repeat the stress test procedure, but after twenty minutes he starts showing flaws with lines again. I think the bga arrived at this point is bad. See-ic and golden chipset do not have this replacement. I believe it is a defect of the bga itself and not of welding.
Thank you